Method of manufacturing a semiconductor device with a pair of radiating terminals and a plurality of lead terminals formed from a single lead frame

ABSTRACT

A semiconductor device is disclosed wherein a pair of radiating terminals and a plurality of lead terminals are formed from a single lead frame. A hole or holes in each radiating terminal are formed with an equal width and in an equal pitch to those of gaps between the lead terminals, and the opposite sides of each hole of the radiating terminal are connected to each other by a support element. The support elements of the radiating terminals and support elements which interconnect the lead terminals are formed with an equal length and in an equal pitch to allow the support elements to be cut away by a plurality of punches which are arranged in an equal pitch and have an equal width.

BACKGROUND OF THE INVENTION

1. Field of the Invention

This invention relates to a method of manufacturing a semiconductordevice, and more particularly to a method of manufacturing asemiconductor device wherein a pair of radiating terminals and aplurality of lead terminals are formed from a single lead frame.

2. Description of the Related Art

Conventionally, semiconductor devices such as an LSI (Large ScaleIntegrated Circuit) and a transistor are utilized in various electronicapparatus.

In such apparatus as just mentioned, a pellet comprising a semiconductorcircuit is encapsulated in a resin member, and a plurality of leadterminals each formed from an elongated conductive plate are provided onthe opposite sides of the resin member. Since those lead terminals areconnected to connection pads of the pellet in the inside of the resinmember, if the semiconductor device is mounted on a circuit board andthe lead terminals are connected to signal lines, then various signalscan be inputted to and outputted from the pellet.

While such semiconductor devices are utilized in variousapplications,for example, a semiconductor device for use with a portabletelephone set consumes a large amount of power, and consequently, apellet of the semiconductor device generates a large amount of heat.Therefore, the generated heat of the pellet must be radiatedefficiently.

A conventional example of a semiconductor device which solves thesubject just described is described below with reference to FIG. 1.

In integrated circuit device 1 which is a semiconductor device shown asan example here, a pellet of an integrated circuit formed from asemiconductor circuit is mounted on a radiating plate in the form of anisland (not shown), and a pair of radiating terminals 2 having acomparatively large width are provided on the opposite left and rightsides of the radiating plate.

A plurality of lead terminals 3 having a comparatively small width arearranged at positions forwardly and rearwardly of and adjacent toradiating terminals 2. Lead terminals 3 are connected to connection padsof the pellet by bonding wires (not shown).

Since the pellet, the radiating plate, the bonding wires, inner portionsof radiating terminals 2 and inner 25 portions of lead terminals 3 areencapsulated in resin member 4, outer portions 5 and 6 of terminals 2and 3 are provided projectingly on the left and right side faces ofresin member 4.

Outer portions 5 and 6 of terminals 2 and 3 are bent downwardly, andeach of radiating terminals 2 has a hole 7 in the form of a slit formedat the bent portion thereof.

When integrated circuit device 1 having such a construction as describedabove is to be mounted onto an upper surface of a circuit board, theplurality of-lead terminals 3 of integrated circuit device 1 areconnected to a plurality of signal lines of the circuit board by solder,and the pair of radiating terminals 2 are connected to conductorpatterns such as grounding lines of the circuit board.

Thus, the pellet can input and output various information signals to andfrom the signal lines of the circuit board, and when the pelletgenerates heat, the heat is radiated from radiating terminals 2.

A method of manufacturing integrated circuit device 1 having such aconstruction as described above is described briefly below withreference to FIGS. 2 and 3.

First, leadframell is formed by etching a thin metal plate as seen inFIG. 2. On this lead frame 11, a plurality of frame patterns 12 ofintegrated circuit devices 1 are arranged in rows and columns, andradiating plate 13 is positioned at the center of one frame pattern 12.

A pair of radiating terminals 2 having a comparatively large width areprovided on the opposite left and right sides of radiating plate 13. Aplurality of lead terminals 3 having a comparatively small width arearranged on the opposite front and rear sides, which are upper and lowersides in FIG. 2, of radiating terminals 2.

Intermediate portions of terminals 2 and 3 are connected to each otherby a plurality of tie bars 14. Outer end portions of terminals 2 and 3are connected to outer frame portion 16 of frame pattern 12 bysuspending pins 15.

Inner portions 17 of lead terminals 3 are formed such that they aredirected radially toward the center of radiating plate 13. Innerportions 18 of radiating terminals 2 are formed integrally withradiating plate 13.

Holes 7 each in the form of a slit are formed at portions of outerportions 5 of radiating terminals 2 at which radiating terminals 2 areto be bent later.

A pellet comprising a semiconductor circuit is placed onto an upper faceof radiating plate 13 of lead frame 11 formed in such a manner asdescribed above, and a plurality of connection pads of the pellet andthe plurality of lead terminals 3 are individually connected to eachother with bonding wires (not shown).

Lead frame 11 on which the pellet and the bonding wires are mountedintegrally in this manner is placed into a cavity of a set of mutuallyremovable metal molds such that it is held at outer portions 5 and 6 ofradiating terminals 2 and 3 thereof by and between the metal molds, andin this state, molten resin is filled into the cavity of the metal moldsand is then left so as to be solidified to form resin member 4.

Then, as shown in FIG. 3, tie bars 14 and suspending pins 15 of leadframe 11 which are exposed to the outside from resin member 4 are cutaway by punches 19 to 21 so that outer portions 5 and 6 of radiatingterminals 2 and lead terminals 3 are separated from each other, andouter portions 5 and 6 are bent downwardly, thereby completingintegrated circuit device 1.

When outer portions 5 and 6 of terminals 2 and 3 are bent in thismanner, although radiating terminals 2 generally have a comparativelylarge width, since holes 7 are formed at the bent portions of radiatingterminals 2, radiating terminals 2 can be bent readily similarly to leadterminals 3 having a comparatively small width.

However, since radiating terminals 2 and lead terminals 3 have differentwidths, punches 19 to 20 for cutting away tie bars 14 and suspendingpins 15 cannot be arranged in an equal pitch.

Where punches 19 and 20 cannot be arranged in an equal pitch, operationsfor setting punches 19 and 20 to a press machine (not shown) arecumbersome, and also the universality of thus set punches 19 and 20 islow.

Further, in order to cut away suspending pins 15 of lead terminals 3having a comparatively small width and suspending pins 15 of radiatingterminals 2 having a comparatively large width, punches 20 having acomparatively small width and punches 21 having a comparatively largewidth are required. In other wards, since a plurality of kinds ofpunches 20 and 21 having different widths are required, the productivityof integrated circuit device 1 is deteriorated thereby.

SUMMARY OF THE INVENTION

It is an object of the present invention to provide a method ofmanufacturing a semiconductor device which is high in productivity and alead frame which contributes to improvement in productivity of asemiconductor device.

In a conventional method of manufacturing a semiconductor device towhich the present invention is applied, a lead frame is formed first.

In the lead frame, a single radiating plate and a plurality of leadterminals of a comparatively small width are connected integrally toeach other by tie bars and suspending pins. The single radiating platehas a pair of radiating terminals of a comparatively large width formedprojectingly on the opposite sides thereof, and the plurality of leadterminals of a comparatively small width are arranged at positionsadjacent to the radiating terminals.

A pellet comprising a semiconductor circuit having a plurality ofconnection pads provided on an upper surface thereof is placed onto anupper surface of the radiating plate of the lead frame formed in such aconfiguration as described above. The plurality of connection pads ofthe pellet and the plurality of lead terminals of the lead frame areconnected individually to each other with bonding wires.

The lead frame on which the pellet and the bonding wires are mountedintegrally is placed into a cavity of a set of mutually removable metalmolds, and the metal molds are closed integrally such that outerportions of the radiating terminals and the lead terminals are held bythe metal molds.

Molten resin is filled into the cavity of the metal molds. The filledresin is left so as to be solidified to form a resin member in which thepellet, the radiating plate, the bonding wires, inner portions of theradiating terminals and inner portions of the lead terminals areencapsulated.

The tie bars and the suspending pins of the lead frame exposed to theoutside from the resin member are cut away to separate the outerportions of the radiating terminals and the lead terminals individuallyfrom each other. The outer portions of the lead terminals and the leadterminals extending outwardly from the resin member are bent downwardly.

According to the present invention in such a method of manufacturing asemiconductor device as described above, when the lead frame is formed,the radiating terminals and the plurality of lead terminals are,connected to each other at portions thereof to be bent later at the tiebars and at least one hole which has an equal inner width and an equalarrangement pitch as those of gaps between the plurality of leadterminals and whose opposite sides are connected to each other by one ofthe tie bars is formed at the portion of each of the radiating terminalsthat is to be bent.

When the tie bars of the lead frame exposed to the outside from theresin member are cut away, the plurality of tie bars positioned at thegaps between the lead terminals and the holes of the radiating terminalsare cut away with an equal width and at an equal pitch.

Then, when the outer portions of the radiating terminals and theplurality of lead terminals are bent, the radiating terminals are bentat the positions of the holes.

Accordingly, with the method of manufacturing a semiconductor device ofthe present invention, the holes are formed in the radiating terminalshaving a comparatively large width of lead frame at the portion to bebent, and the opposite sides of each of the holes are connected to eachother by one of the tie bars. Since the radiating terminals and theplurality of lead terminals are connected to each other by the tie barsand the plurality of tie bars having an equal inner width and an equalarrangement pitch to those of the tie bars, the tie bars are cut away bya plurality of punches arranged in an equal pitch and having an equalwidth.

Since the plurality of punches for cutting away the plurality of tiebars can be formed with an equal width and can be arranged at an equalpitch, operations for setting the punches in position into a pressmachine are simple, and also the universality of the punches thus set isgood.

It is to be noted that, in the present invention, the direction in whichthe pellet is mounted with respect to the radiating plate is referred toas upward direction while a direction perpendicular to the direction isreferred to as sideward direction. However, such directions are usedconveniently in order to simplify description and do not restrict anydirection when the device is manufactured or used actually.

Further, the radiating plate in the present invention signifies a memberon which a pellet is mounted and which contributes to radiation of heatfrom the pellet, and allows an island made of a metal.

In the method of manufacturing a semiconductor device of the presentinvention, when the lead frame is formed, outer end portions of theradiating terminals and the plurality of lead terminals may be connectedto an outer frame portion of the lead frame by a plurality of suspendingpins having an equal inner width and an equal arrangement pitch, and,when the tie bars and the suspending pins of the lead frame exposed tothe outside from the resin member are cut away, the plurality ofsuspending pins which interconnect the outer end portions of theradiating terminals and the plurality of lead terminals and the outerframe portion may be cut away with equal width and in equal pitch.

In this instance, since radiating terminals having a comparatively largewidth and the lead terminals of a comparatively small width of leadframe are connected to the outer frame portion of the lead frame by aplurality of suspending pins having an equal inner width and an equalarrangement pitch, the suspending pins are cut away by a plurality ofpunches arranged in an equal pitch and having an equal width.

Since the plurality of punches for cutting away the plurality ofsuspending pins can be formed with an equal width and can be arranged inan equal pitch, operations for setting the punches in position into apress machine are simple and also the universality of the punches thusset is good.

A conventional lead frame to which the present invention is appliedincludes a substantially rectangular radiating plate, a pair ofradiating terminals of a comparatively large width provided projectinglyon the opposite sides of the radiating plate, a plurality of leadterminals of a comparatively small width arranged at positions adjacentto the radiating terminals, an outer frame portion positioned on theouter side of outer end portions of the radiating terminals and theplurality of lead terminals, a plurality of suspending pins forconnecting the outer end portions of the radiating terminals and theplurality of lead terminals individually to the outer frame portion, anda plurality of tie bars for interconnecting intermediate portions of theradiating terminals and the plurality of lead terminals.

In the present invention in such a lead frame as described above,

each of the radiating terminals has at least one hole formed thereinsuch that the hole has an equal width and an equal arrangement pitch asthose of gaps between the plurality of lead terminals and the oppositesides of the hole are connected to each other by one of the tie bars,and the plurality of tie bars which interconnect the intermediateportions of the radiating terminals and the plurality of lead terminalshave an equal overall length and an equal arrangement pitch to those ofthe tie bars of the holes of the radiating terminals.

Accordingly, with the lead frame of the present invention, the holes areformed in the radiating terminals having a comparatively large width atthe portions to be bent of, and the opposite sides of each of the holesare connected to each other by one of the tie bars. Since the radiatingterminals and the plurality of lead terminals are connected to eachother by the tie bars and the plurality of tie bars having an equalinner width and an equal arrangement pitch to those of the tie bars, thetie bars are cut away by a plurality of punches arranged in an equalpitch and having an equal width.

Since the plurality of punches for cutting away the plurality of tiebars can be formed with an equal width and can be arranged at an equalpitch, operations for setting the punches in position into a pressmachine are simple, and also the universality of the punches thus set isgood.

The lead frame of the present invention may be constructed such that theouter end portions of the radiating terminals and the plurality of leadterminals are connected to the outer frame portion of the lead frame bya plurality of suspending pins which have an equal inner width and anequal arrangement pitch.

In this instance, since radiating terminals having a comparatively largewidth and the lead terminals of a comparatively small width of leadframe are connected to the outer frame portion of the lead frame by aplurality of suspending pins having an equal inner width and an equalarrangement pitch, the suspending pins are cut away by a plurality ofpunches arranged in an equal pitch and having an equal width.

Since the plurality of punches for cutting away the plurality ofsuspending pins can be formed with an equal width and can be arranged inan equal pitch, operations for setting the punches in position into apress machine are simple and also the universality of the punches thusset is good.

The above and other objects, features and advantages of the presentinvention will become apparent from the following description withreference to the accompanying drawings which illustrate examples of thepresent invention.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a perspective view showing an appearance of a semiconductordevice of a conventional example;

FIG. 2 is a plan view showing a lead frame of a conventional example;

FIG. 3 is a plan view showing a condition wherein tie bars andsuspending pins of a lead frame are cut away;

FIG. 4 is a plan view showing a lead frame of an embodiment of thepresent invention;

FIG. 5 is a plan view showing a condition wherein tie bars andsuspending pins of the lead frame are cut away;

FIG. 6 is a plan view showing a condition after the tie bars and thesuspending pins of the lead frame are cut away; and

FIG. 7 is a perspective view showing an appearance of a completedsemiconductor device.

FIG. 8 is a flowchart showing a method of manufacturing a semiconductordevice.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

An embodiment of the present invention is described with reference toFIGS. 4 to 7. It is to be noted that those elements of the presentembodiment which are common to those of the conventional exampledescribed hereinabove are denoted by same terms and detailed descriptionof them is omitted here.

First, also in integrated circuit device 31 which is a semiconductordevice of the present embodiment, a pair of radiating terminals 32having a comparatively large width are provided projectingly on theopposite left and right sides of a radiating plate on which a pellet ismounted as shown in FIG. 7 similarly as in integrated circuit device 1described hereinabove.

A plurality of lead terminals 33 having a comparatively small width aredisposed at positions forwardly and rearwardly of and adjacent toradiating terminals 32, and outer portions 35 and 36 of terminals 32 and33 provided in and projecting from resin member 34 are bent downwardly.

However, in integrated circuit device 31 of the present embodiment,different from integrated circuit device 1 described hereinabove, twoholes 37 having a comparatively small width are formed at a bent portionof each of radiating terminals 32. Holes 37 of radiating terminals 32have an inner width equal to that of the gaps between the plurality oflead terminals 33 and have an arrangement pitch equal to that of thegaps.

Also when integrated circuit device 31 of the present embodiment havingsuch a construction as described above is mounted onto an upper surfaceof a circuit board, the plurality of lead terminals 33 of integratedcircuit device 31 are connected to a plurality of signal lines of thecircuit board by solder and the pair of radiating terminals 32 areconnected to conductor patterns such as grounding lines or like lines ofthe circuit board.

Consequently, the pellet can input and output various informationsignals to and from the signal lines of the circuit board, and heatgenerated by the pellet can be radiated from radiating terminals 32.

Here, a method of manufacturing such integrated circuit device 31 asdescribed above is described briefly below with reference to thedrawings.

First, lead frame 41 is formed by etching a thin metal plate as seen inFIG. 4.

Also with this lead frame 41, a plurality of frame patterns 42 ofintegrated circuit devices 31 are provided in rows and columns, andradiating plate 43 is positioned at the center of each one frame pattern42.

A pair of radiating terminals 32 having a comparatively large width areprovided projectingly on the opposite left and right sides of radiatingplate 43. A plurality of lead terminals 33 having a comparatively smallwidth are arranged on the opposite front and rear sides of radiatingterminals 32, which are upper and lower sides in FIG. 4.

Portions of terminals 32 and 33 to be bent are connected to each otherby a plurality of tie bars 44. Outer end portions of terminals 32 and 33are connected to outer frame portion 46 of frame pattern 42 bysuspending pins 45.

Inner portions 47 of lead terminals 33 are formed such that they aredirected radially toward the center of radiating plate 43. Innerportions 48 of radiating terminals 32 are formed integrally withradiating plate 43 .

Two holes 37 are formed at a portion of outer portion 35 of each ofradiating terminals 32 at which radiating terminal 32 is to be bent.However, since the opposite front and rear sides of each of holes 37which are the upper and lower sides in FIG. 4 are connected by one oftie bars 44, the two holes 37 at present point of time are formed asfour holes.

Since holes 37 of radiating terminals 32 have an equal inner width andhave an equal arrangement pitch as those of the gaps between theplurality of lead terminals 33 as described above, those tie bars 44which interconnect the opposite sides of holes 37 have an equal overalllength and an equal arrangement pitch as those of tie bars 44 whichinterconnect terminals 32 and 33.

Further, while the plurality of lead terminals 33 having a comparativelysmall width are individually connected to outer frame portion 46 offrame pattern 42 by a plurality of suspending pins 45 having acomparatively small width, each of radiating terminals 32 having acomparatively large width is connected to three suspending pins 45having a comparatively small width. Those suspending pins 45 have anequal inner width and have an equal arrangement pitch.

A pellet comprising a semiconductor circuit is placed onto an uppersurface of radiating plate 43 of lead frame 41 formed in such a manneras described above, and a plurality of connection pads of the pellet andthe plurality of lead terminals 33 are individually connected to eachother with bonding wires (not shown).

Lead frame 41 on which the pellet and the boarding wires are mountedintegrally in this manner is placed into a cavity of a set of mutuallyremovable metal molds such that it is held at outer portions 35 and 36of terminals 32 and 33 by the between the metal molds, and in thiscondition, molten resin is filled into the cavity of the metal molds andis then left so as to be solidified to form resin member 34.

Then, as seen in FIGS. 5 and 6, tie bars 44 and suspending pins 45 oflead frame 41 which are exposed outwardly from resin member 34 are cutaway and outer portions 35 and 36 of terminals 32 and 33 are separatedfrom each other. Then, outer portions 35 and 36 are bent downwardly asseen in FIG. 7, thereby completing integrated circuit device 31.

With integrated circuit device 31 of the present embodiment, when outerportions 35 and 36 of terminals 32 and 33 are bent, although radiatingterminals 32 have a generally large width, since they have holes 37 atportions to be bent thereof, they can be bent readily similarly to leadterminals 33 having a comparatively small width.

Besides, even if radiating terminals 32 and lead terminals 33 havedifferent widths from each other, since tie bars 44 and suspending pins45 have an equal width and are arranged in an equal pitch, punches 51and 52 for cutting away them can be arranged in an equal pitch.

Consequently, an operation of setting punches 51 and 52 in position intoa press machine (not shown) is simple, and also the universality ofpunches 51 and 52 thus set is high.

Further, lead terminals 33 having a comparatively small width andradiating terminals 32 having a comparatively large width are connectedto outer frame portion 46 of lead frame 41 by suspending pins 45 havingan equal comparatively small width. Accordingly, for punches 52 forcutting away suspending pins 45, a single kind of punches can be used,and integrated circuit device 31 can be manufactured in a highproductivity.

While preferred embodiments of the present invention have been describedusing specific terms, such description is for illustrative purposesonly, and it is to be understood that changes and variations may be madewithout departing from the spirit or scope of the following claims.

What is claimed is:
 1. A method of manufacturing a semiconductor device,comprising the steps of:forming a lead frame including a singleradiating plate having a pair of radiating terminals of a comparativelylarge width formed projectingly on the opposite sides thereof and aplurality of lead terminals of a comparatively small width arranged atpositions adjacent to the radiating terminals, the radiating terminalsand the plurality of lead terminals being connected to each other bymeans of the support elements, the radiating terminals each having atleast one hole, whose width and pitch are equal in dimension to thewidth of gaps between the plurality of lead terminals, and whoseopposite sides are connected to each other by one of the supportelements; placing a pellet comprising a semiconductor circuit and havinga plurality of connection pads on an upper surface thereof onto an uppersurface of the radiating plate of the lead frame; connecting theplurality of connection pads of the pellet and the plurality of leadterminals of the lead frame individually to each other with bondingwires; placing the lead frame on which the pellet and the bonding wiresare mounted integrally into a cavity of a set of mutually removablemetal molds; closing said metal molds such that portions of theradiating terminals and portions of the lead terminals are held by saidmetal molds; filling molten resin into said cavity of said metal molds;solidifying the filled resin so as to form a resin member in which thepellet, the radiating plate, the bonding wires, the portions of theradiating terminals and the portions of the lead terminals areencapsulated; cutting away the plurality of support elements positionedat the gaps between the lead terminals exposed to the outside from theresin member and the holes of the radiating terminals exposed to theoutside from the resin member with an equal width and at an equal pitchto separate the radiating terminals and the lead terminals individuallyfrom each other; and bending the lead terminals exposed to the outsidefrom the resin member downwardly and bending the radiating terminals atthe positions of the holes exposed to the outside from the resin memberdownwardly.
 2. A method of manufacturing a semiconductor device,comprising the steps of:forming a lead frame including a singleradiating plate having a pair of radiating terminals of a comparativelylarge width formed projectingly on the opposite sides thereof and aplurality of lead terminals of a comparatively small width arranged atpositions adjacent to the radiating terminals, the radiating terminalsand the plurality of lead terminals are connected to an outer frameportion of the lead frame by a plurality of support elements having anequal width and an equal pitch, the radiating terminals and theplurality of lead terminals being connected to each other by means ofthe support elements, the radiating terminals each having at least onehole two holes, whose width and pitch are equal in dimension to thewidth of gaps between the plurality of lead terminals, and whoseopposite sides are connected to each other by one of the supportelements; placing a pellet comprising a semiconductor circuit and havinga plurality of connection pads on an upper surface thereof onto an uppersurface of the radiating plate of the lead frame; connecting theplurality of connection pads of the pellet and the plurality of leadterminals of the lead frame individually to each other with bondingwires; placing the lead frame on which the pellet and the bonding wiresare mounted integrally into a cavity of a set of mutually removablemetal molds; closing said metal molds such that portions of theradiating terminals and portions of the lead terminals are held by saidmetal molds; filling molten resin into said cavity of said metal molds;solidifying the filled resin so as to form a resin member in which thepellet, the radiating plate, the bonding wires, the portions of theradiating terminals and the portions of the lead terminals areencapsulated; cutting away the plurality of support elements positionedat the gaps between the lead terminals exposed to the outside from theresin member and the holes of the radiating terminals exposed to theoutside from the resin member with an equal width and at an equal pitchto separate the radiating terminals and the lead terminals individuallyfrom each other, and cutting away the support elements which connectedthe outer frame portion of the lead frame to the radiating terminals andthe plurality of lead terminals with an equal width and at an equalpitch; and bending the lead terminals exposed to the outside from theresin member downwardly and bending the radiating terminals at thepositions of the holes exposed to the outside from the resin memberdownwardly.
 3. A method of manufacturing a semiconductor device,comprising the steps of:forming a lead frame including a singleradiating plate having a pair of radiating terminals of a comparativelylarge width formed projectingly on the opposite sides thereof and aplurality of lead terminals of a comparatively small width arranged atpositions adjacent to the radiating terminals, the radiating terminalsand the plurality of lead terminals being connected to each other bymeans of the support elements, the radiating terminals each having atleast two holes, whose width and pitch are equal to those of gapsbetween the plurality of lead terminals, and whose opposite sides areconnected to each other by one of the support elements; placing a pelletcomprising a semiconductor circuit and having a plurality of connectionpads on an upper surface thereof onto an upper surface of the radiatingplate of the lead frame; connecting the plurality of connection pads ofthe pellet and the plurality of lead terminals of the lead frameindividually to each other with bonding wires; placing the lead frame onwhich the pellet and the bonding wires are mounted integrally into acavity of a set of mutually removable metal molds; closing said metalmolds such that portions of the radiating terminals and portions of thelead terminals are held by said metal molds; filling molten resin intosaid cavity of said metal molds; solidifying the filled resin so as toform a resin member in which the pellet, the radiating plate, thebonding wires, the portions of the radiating terminals and the portionsof the lead terminals are encapsulated; cutting away the plurality ofsupport elements positioned at the gaps between the lead terminalsexposed to the outside from the resin member and the holes of theradiating terminals exposed to the outside from the resin member with anequal width and at an equal pitch to separate the radiating terminalsand the lead terminals individually from each other; and bending thelead terminals exposed to the outside from the resin member downwardlyand bending the radiating terminals at the positions of the holesexposed to the outside from the resin member downwardly.
 4. A method ofmanufacturing a semiconductor device, comprising the steps of:forming alead frame including a single radiating plate having a pair of radiatingterminals of a comparatively large width formed projectingly on theopposite sides thereof and a plurality of lead terminals of acomparatively small width arranged at positions adjacent to theradiating terminals, the radiating terminals and the plurality of leadterminals are connected to an outer frame portion of the lead frame by aplurality of support elements having an equal width and an equal pitch,the radiating terminals and the plurality of lead terminals beingconnected to each other by means of the support elements, the radiatingterminals each having at least two holes, whose width and pitch areequal to those of gaps between the plurality of lead terminals, andwhose opposite sides are connected to each other by one of the supportelements; placing a pellet comprising a semiconductor circuit and havinga plurality of connection pads on an upper surface thereof onto an uppersurface of the radiating plate of the lead frame; connecting theplurality of connection pads of the pellet and the plurality of leadterminals of the lead frame individually to each other with bondingwires; placing the lead frame on which the pellet and the bonding wiresare mounted integrally into a cavity of a set of mutually removablemetal molds; closing said metal molds such that portions of theradiating terminals and portions of the lead terminals are held by saidmetal molds; filling molten resin into said cavity of said metal molds;solidifying the filled resin so as to form a resin member in which thepellet, the radiating plate, the bonding wires, the portions of theradiating terminals and the portions of the lead terminals areencapsulated; cutting away the plurality of support elements positionedat the gaps between the lead terminals exposed to the outside from theresin member and the holes of the radiating terminals exposed to theoutside from the resin member with an equal width and at an equal pitchto separate the radiating terminals and the lead terminals individuallyfrom each other, and cutting away the support elements which connectedthe outer frame portion of the lead frame to the radiating terminals andthe plurality of lead terminals with an equal width and at an equalpitch; and bending the lead terminals exposed to the outside from theresin member downwardly and bending the radiating terminals at thepositions of the holes exposed to the outside from the resin memberdownwardly.